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Hi there,
I got a problem with distributing a device, which I partitioned into sub-parts, onto (hierarchical) sub-sheets of a schematic. If I select my device divided into 9 parts from the library, place it onto the top sheet and then try to distribute each sub-part onto a new sub-sheet by cut and paste, the "ICx.y" numbering gets mangled and the connection to the original device is seemingly destroyed. By the looks of it, DipTrace is making a completely new part from the sub-part of a partitioned device, which is not what I want. Each sub-sheet with a sub-part shows up as a complete footprint of the overall device on the layout editor.
For clarity, I'd like to partition my complex devices (like FPGAs) into sub-parts for ease of use and simplify the schematic for a great deal. Those sub-parts are to be distributed onto sub-sheets.
Can the problem be solved in any way, or has this kind of approach not yet been considered by the team?
Best regards
PCBee
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