It seems that on large copper pours it updates very slow. I have a two layer 11x9 board with around 1000 pins, and the bottom layer is a ground plane. My dual core 2.0ghz laptop takes around 3-5 minutes to update the pour, and my dual 3.0 desktop is taking a minute or two. This seems a bit much, and I am not clear that it has always been this way with the older versions.

1. Is it possible that some optimization needs to be done with this?

2. Perhaps a progress bar would be in place here?

Please check copper pour properties. Small line width and line spacing cause slow copper pour updating. Make sure that you have reasonable parameters.
1. We optimize some algorithms but these optimizations may lead to new bugs in core features. We will consider new algorithm of copper pour filling for future versions.
2. Progress bar makes sense. But 3-5 minus for copper pour updating is too long.

Hey,

that is true that the copper pour update is slow, but I think is still OK. For example I designed a powerboard with size of 590x200mm, 6 layer and aprox. 150 copper pours and additianly I had on very layer a GND or 24V main copper pour. In proporties I used smalles line clearance and width (unfortunatly only 0,1mm) for every copper pour. To update all copper pours I needed aprox. 3min. Notebook: Windows 7 64Bit, Intel i7 2,5Ghz, 8GBRAM

@Alex
is it possible to use the line clearance and width of less than 0,1mm, for example only 0,01mm.

Cheers

It is possible but not recommend to use very thin lines in copper pours. First reason is slower filling. Second reason is some manufacturers won't be happy with that copper pours.

Hey Alex,

yes you are right, but if you are working with very small clearance between very small components, you need very small line clearance and width.

Cheers