Can vias be stitched on ground pads using the Layout stitching tool?

Problem fixed. The pattern was incorrect; sorry about that!

Thanks, yes, I verified that the copper pour is assigned to the same GND net.

Hello,

I created a pattern for the TLF-50, a 2.4mm RF Vertical Launch connector.

When I flood the Top Layer and assign the pour to Ground, the Ground pad on the connector does not get flooded over.

I would like the flood to include the connector's Ground pad. How would I do this?

See the ...

That worked well. Thank you.

This PCB layout calls for 16 mil traces that connect to 8 mil wide pads. Would you use a polygon to finish the last 20 mils to the trace? Or is there an easier way to make the connection?

Thanks for any help,
Steve

Hi,

Could someone help with DipTrace's Layer conversion? See the attached picture of a Mini-Circuits YAT-2A+ footprint I'm importing from an Ultra Librarian Autocad *.dxf file. Did I do this correctly, or would you recommend different layer match ups?

Thanks,

Stephen

When do you expect DipTrace 5.0 to be released?

Great program, thanks!

The attached PCB is a 4 layer board, intended to have a top signal layer and all other layers ground.

Unfortunately the PCB manufacturer interpreted the middle layers L2 and L3 as Inner layers of solid copper but with clearances for vias (for only the thru vias spread throughout the flooded ground ...