When I apply direct thermal connection on a pad located in a copper pour I get a DRC error:
Pad H2:1 - Copper pour (Gap=-0.073 in; Rule=0.005in
Drill - Copper pour (Gap=-.065 in; Rule=0.006 in)
How is there a negative gap, and what do I need to do or change to fix this? Is this a bug?
Making PCB Layouts, Manual routing, Auto-routing, Copper pouring, Updating from Schematic, Manufacturing Output
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