Coppper pour issue

[atticusedwards]

I just modified a board layout created with v3.x PBC Layout using the recently released v4.0.0.5. The board has 4 layers with a mix of surface-mount and through-hole components. After Updating copper pours using v4.x, clearance violations were reported between the internal layer pours and a few through-hole pads, which coincidentally had rectangular pads on outer layers. If the pad shape is changed from Rectangle to Polygon, the pour works correctly. In my case only a few pads were affected, though I can imagine designs where the workaround would be a major hassle -- defining square pads as polygons is rather tedious. Thanks.