Copper Pour and Ground Flood Problem

Making PCB Layouts, Manual routing, Auto-routing, Copper pouring, Updating from Schematic, Manufacturing Output
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owkmann
Posts: 9
Joined: 21 Aug 2022, 23:19

Copper Pour and Ground Flood Problem

#1 Post by owkmann » 23 Mar 2025, 18:46

Hello,

I created a pattern for the TLF-50, a 2.4mm RF Vertical Launch connector.

When I flood the Top Layer and assign the pour to Ground, the Ground pad on the connector does not get flooded over.

I would like the flood to include the connector's Ground pad. How would I do this?

See the attached screen capture, showing a gap between the copper pour and the pad.

Thanks for your help,

Steve
Copper Flood.PNG
Copper Flood.PNG (29.85 KiB) Viewed 17078 times

Alex
Technical Support
Posts: 4060
Joined: 14 Jun 2010, 10:43

Re: Copper Pour and Ground Flood Problem

#2 Post by Alex » 25 Mar 2025, 09:31

The pad and the copper pour should be connected the the same net. If the pad has already connected to GND net, please open copper pour properties and verify which net it is connected to.

owkmann
Posts: 9
Joined: 21 Aug 2022, 23:19

Re: Copper Pour and Ground Flood Problem

#3 Post by owkmann » 26 Mar 2025, 01:43

Thanks, yes, I verified that the copper pour is assigned to the same GND net.

owkmann
Posts: 9
Joined: 21 Aug 2022, 23:19

Re: Copper Pour and Ground Flood Problem

#4 Post by owkmann » 29 Mar 2025, 16:48

Problem fixed. The pattern was incorrect; sorry about that!

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