copper pour creating island around pad at same potential

Making PCB Layouts, Manual routing, Auto-routing, Copper pouring, Updating from Schematic, Manufacturing Output
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lclore
Posts: 14
Joined: 20 May 2013, 19:48

copper pour creating island around pad at same potential

#1 Post by lclore » 11 Jan 2022, 10:39

Hi, I am not figuring this out. Downloaded a KiCad file for a TI SMPS and when creating a copper pour around all pads of the same potential, it is putting an island around the corner pads. Looking to fill p8 and p14 with copper pour

area of interest is circled in red. island removal settings do not impact copper pour in this area.
I am missing something...
257 smps pour.png
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Tomg
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Posts: 1863
Joined: 20 Jun 2015, 14:39

Re: copper pour creating island around pad at same potential

#2 Post by Tomg » 11 Jan 2022, 11:13

Hard to tell from the screenshot, but there might be some independent copper pieces touching those pads. If not, bring up the
"Copper Pour Properties" dialog window (right-click on its edge and select "Properties..." in the context menu)
and check out the settings under the [Connectivity] tab; specifically, the "Thermals:" settings.

If that doesn't help answer any questions, right-click on the pad and select "Thermal Settings..." in the context menu
to bring up the "Thermal" dialog window. Check to see if the pad has any custom thermal settings that might be causing the problem.

If the mystery persists and you don't need to protect your design, consider posting the DipTrace PCB file here (or a small part of it)
so others can have a crack at helping you troubleshoot the problem.
Tom

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